RFID eNews

New Product Line: Etching Antenna

    It is known that the etching antenna can be utilized to produce RFID inlays, labels, cards and widely used in various fields such as logistics, supply chain, public transportation, events, and library management etc. The etching antenna technology is beneficial to mass production processes for the purpose of product standardization and cost reduction.

    Since 1999, SAG has been in pursuit of producing high-quality RFID transponders and enhancing its core competence by continuous advancement. In order to fulfill various requirements from customers, SAG extended its product line to aluminum etching antenna. Accumulating years of know-how in antenna design and aluminum etching technology, SAG is glad to announce that it can provide ordinary and customized patterns of aluminum etching antenna per customer's request. Owing to the efforts on R&D, even as a small dimension of 14.5mm x 14.5mm is no longer a problem for SAG. Features a delicate track width of 150μm, the 14.5mm x 14.5mm aluminum etching antenna offers better reading performance and lower price than copper etching antenna.

LabelEXPO Europe 2013 in Brussels, Belgium

    LabelExpo Europe 2013 is the world's largest event for the label and package printing industry. Launched in London in 1980, it moved to Brussels in 1985, where it has remained since. The scale of the show is staggering (seven halls and over 550 exhibitors). It will be the first time that SAG participates in and reveals its products at label related exhibition. We look forward to meeting you there!

  • Place : Brussels Expo, Belgium
  • Date : 24 - 27 Sep, 2013
  • Booth No. : 7L02

AUTO ID EXPO 2013 in Tokyo, Japan

    AUTO ID EXPO is the grand-scale automatic identification exhibition in Japan which devotes exclusively to cutting-edge automatic identification products, technologies and solutions. SAG will attend the 15th annual AUTO ID EXPO and demonstrate its RFID products. We expect to see you there!

  • Place : Tokyo Big Sight, Japan
  • Date : 25–27, Sep, 2013
  • Booth No. : D-3
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