Overmolded Square Tag

Produced by overmolded process, it can resist the heat, pressure and chemical in harsh environment. It is also ideal for industrial applications where a robust and durable tag is needed.
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Specifications

Dimensions (mm)D 20 x T 1.0D 25 x T 1.0D 30 x T 0.45
D 30 x T 1 (with adhesive)
D 35 x T 1.0D50 xT1.0
MaterialPETPETPETPETPET
FrequencyLF/ HFLF/ HFLF/ HFLF/ HFLF
Operating Temperature(°C)-15 to 55-15 to 55-15 to 55-15 to 55-15 to 55
Storage Temperature(°C)-15 to 55-15 to 55-15 to 55-15 to 55-15 to 55
IP RatingIP65IP65IP65IP65IP65
Applicable SurfaceNon-metalNon-metalNon-metalNon-metalNon-metal
RFID ChipMICROCHIP ATA5577
NXP MIFARE Classic EV1
NXP MIFARE DESFire EV1
NXP ICODE SLIX
NXP HITAG 1/ NXPHITAG S2048/ NXPHITAG S256/
NXP NTAG213
Sony Felica RC-S966
Fujitsu MB89R118
EM4102
EM4200
EM4450
LEGIC MIM256
MICROCHIP ATA5577
NXP MIFARE Classic EV1
NXP MIFARE DESFire EV1
NXP HITAG 1/HITAG 2
Fujitsu MB89R118
EM4102
EM4200
LEGIC MIM256/MIM1024
LEGIC ATC1024/ATC2048
Infineon SRF55V10P
MICROCHIP ATA5577
NXP MIFARE Classic EV1
NXP MIFARE DESFire EV1
NXP ICODE SLIX
NXP HITAG 1/HITAG 2
NXP HITAG S
Fujitsu MB89R118
EM4102
EM4200
NXP MIFARE Classic EV1
NXP HITAG 2
NXP HITAG S
EM4102
NFC StandardType 2 / Type 3 / Type 4 / Type 5Type 4Type 4 / Type 5n/an/a
RF Interface ProtocolISO/IEC 15693
ISO/IEC 14443A
ISO/IEC 15693
ISO/IEC 14443A
ISO/IEC 15693
ISO/IEC 14443A
ISO/IEC 14443An/a
OptionsAdhesiveAdhesiveAdhesiveAdhesiveAdhesive
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